柔性电子器件的自修复金属互连

T. Koshi, E. Iwase
{"title":"柔性电子器件的自修复金属互连","authors":"T. Koshi, E. Iwase","doi":"10.23919/ICEP.2019.8733474","DOIUrl":null,"url":null,"abstract":"We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Self-Healing Metal Interconnect for Flexible Electronic Device\",\"authors\":\"T. Koshi, E. Iwase\",\"doi\":\"10.23919/ICEP.2019.8733474\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.\",\"PeriodicalId\":213025,\"journal\":{\"name\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP.2019.8733474\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733474","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

我们开发了一种自我修复的金属互连,并将其应用于柔性电子设备。自我修复的金属互连体即使因拉伸变形而断裂,也能再次恢复其导电性。为了实现自修复,采用了金属纳米颗粒的介电电泳。本文描述了一种使用自愈金属互连的柔性电子器件的设计、制造和评估。该器件由自修复金属互连和表面安装的发光二极管(LED)芯片组成。我们证实了器件阻抗的降低和LED芯片通过断开的互连自愈而重新发射。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Self-Healing Metal Interconnect for Flexible Electronic Device
We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.
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