利用信道营业利润率(COM)探索112 Gbps的背板信道设计

F. de Paulis, Tim Wang-Lee, R. Mellitz, M. Resso, Rick Rabinovich, O. Danzy
{"title":"利用信道营业利润率(COM)探索112 Gbps的背板信道设计","authors":"F. de Paulis, Tim Wang-Lee, R. Mellitz, M. Resso, Rick Rabinovich, O. Danzy","doi":"10.1109/emcsi38923.2020.9191569","DOIUrl":null,"url":null,"abstract":"High speed digital design is constantly attracting the attention of the electronic industry due to the constant development of telecommunication standards, with the consequence of ever growing data rate and new modulation schemes. The Channel Operating Margin (COM) comes up as a powerful tool for channel and physical layer designers to explore the design space at an early stage, as well as to optimize the channel physical parameters, thus overcoming the classic channel performance metrics such as eye diagram and BER. The analysis of the test cases proposed herein will guide through the use of COM and the channel analysis by investigating a 112 Gbps PAM4 chip-to-chip communication over a complex channel composed of a host board, a mezzanine connector, and a daughter card. Accurate analysis of these elements is carried out based on the connector characterization by measurements and full wave models; the PCBs, instead, are modeled as multiconductor transmission lines to resemble the typical configuration of coupled differential striplines. A comprehensive discussion of the COM results set relevant guidelines for a pre-layout analysis of such high speed communication channels.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Backplane Channel Design Exploration at 112 Gbps Using Channel Operating Margin (COM)\",\"authors\":\"F. de Paulis, Tim Wang-Lee, R. Mellitz, M. Resso, Rick Rabinovich, O. Danzy\",\"doi\":\"10.1109/emcsi38923.2020.9191569\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High speed digital design is constantly attracting the attention of the electronic industry due to the constant development of telecommunication standards, with the consequence of ever growing data rate and new modulation schemes. The Channel Operating Margin (COM) comes up as a powerful tool for channel and physical layer designers to explore the design space at an early stage, as well as to optimize the channel physical parameters, thus overcoming the classic channel performance metrics such as eye diagram and BER. The analysis of the test cases proposed herein will guide through the use of COM and the channel analysis by investigating a 112 Gbps PAM4 chip-to-chip communication over a complex channel composed of a host board, a mezzanine connector, and a daughter card. Accurate analysis of these elements is carried out based on the connector characterization by measurements and full wave models; the PCBs, instead, are modeled as multiconductor transmission lines to resemble the typical configuration of coupled differential striplines. A comprehensive discussion of the COM results set relevant guidelines for a pre-layout analysis of such high speed communication channels.\",\"PeriodicalId\":189322,\"journal\":{\"name\":\"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/emcsi38923.2020.9191569\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/emcsi38923.2020.9191569","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

随着通信标准的不断发展,数据速率不断提高,调制方式不断创新,高速数字设计日益受到电子行业的关注。信道运营边际(COM)是信道和物理层设计者在早期阶段探索设计空间以及优化信道物理参数的强大工具,从而克服了经典的信道性能指标,如眼图和误码率。本文提出的测试用例分析将通过COM的使用和通道分析来指导,通过研究由主机板、夹层连接器和子卡组成的复杂通道上的112 Gbps PAM4芯片对芯片通信。根据测量和全波模型的连接器特性,对这些元素进行准确分析;相反,pcb被建模为多导体传输线,以类似于耦合差分带状线的典型配置。对COM结果的全面讨论为这种高速通信通道的预布局分析设定了相关的指导方针。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Backplane Channel Design Exploration at 112 Gbps Using Channel Operating Margin (COM)
High speed digital design is constantly attracting the attention of the electronic industry due to the constant development of telecommunication standards, with the consequence of ever growing data rate and new modulation schemes. The Channel Operating Margin (COM) comes up as a powerful tool for channel and physical layer designers to explore the design space at an early stage, as well as to optimize the channel physical parameters, thus overcoming the classic channel performance metrics such as eye diagram and BER. The analysis of the test cases proposed herein will guide through the use of COM and the channel analysis by investigating a 112 Gbps PAM4 chip-to-chip communication over a complex channel composed of a host board, a mezzanine connector, and a daughter card. Accurate analysis of these elements is carried out based on the connector characterization by measurements and full wave models; the PCBs, instead, are modeled as multiconductor transmission lines to resemble the typical configuration of coupled differential striplines. A comprehensive discussion of the COM results set relevant guidelines for a pre-layout analysis of such high speed communication channels.
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