用分析方法研究了贮存时间对镀锡可焊性的影响

2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS) Pub Date : 2016-10-01 DOI:10.1109/ICRMS.2016.8050165

Hui Xu

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引用次数: 0

摘要

本文主要研究了存放时间对两种平鸥翼引线镀锡在塑料封装IC器件上可焊性的影响。设计老化试验，然后利用x射线光电子能谱(XPS)、润湿平衡试验和数据分析，得到存储涂层的老化程度和终端润湿平衡的变化。从而为元件的逻辑存储条件的建立提供了依据。

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An analytical method to find the effect of storage time on solderability of Sn plating

This paper mainly studied the effect of storage time on solderability of two kinds of Sn plating of flat gull wing leads on plastic package IC component. Design the aging test, and then use Xray photoelectron spectroscopy (XPS), wetting balance test and data analysis, to obtain storage of coating aging degree and the change of the terminal wetting balance. Consequently, provided the criterion for establish the logical storage term of components.

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2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS)

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