一种结构化的mcm路由方法

Chua Hong Chuck, C. Chai, T. Chua
{"title":"一种结构化的mcm路由方法","authors":"Chua Hong Chuck, C. Chai, T. Chua","doi":"10.1109/KES.1997.616917","DOIUrl":null,"url":null,"abstract":"This paper presents a structured methodology for routing of multichip modules (MCMs) suitable for an EDA system that can guarantee 100% completion of routes irrespective of connection density. It uses a rather simple and straightforward modularized approach which, not only guarantees 100% completion of routes, but also optimizes and predetermines the number of layers required. This approach is structured using a Pre-sorter Module (PSM) and a Central Routing Adapter (CRA). Each chip or sub-module in an MCM will go through the PSM that re-arranges the node connection sequence by means of a horizontal-vertical matrix prior to the connection to the CRA. The CRA provides direct point-to-point connections based on the netlist for all chips or sub-modules in the MCM. The set of connections between the nodes of two chips (or sub-modules) is defined as a connection relationship. The number of connection relationships is n(n-1)/2, where n is the number of chips or sub-modules. By this approach, maximum number of layers in the CRA to route all connections among the chips or sub-modules will be (n-2). The design and development of these PSM and CRA are elaborated, and a 4-chip MCM example is used for illustration.","PeriodicalId":166931,"journal":{"name":"Proceedings of 1st International Conference on Conventional and Knowledge Based Intelligent Electronic Systems. KES '97","volume":"76 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A structured approach for routing of MCMs\",\"authors\":\"Chua Hong Chuck, C. Chai, T. Chua\",\"doi\":\"10.1109/KES.1997.616917\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a structured methodology for routing of multichip modules (MCMs) suitable for an EDA system that can guarantee 100% completion of routes irrespective of connection density. It uses a rather simple and straightforward modularized approach which, not only guarantees 100% completion of routes, but also optimizes and predetermines the number of layers required. This approach is structured using a Pre-sorter Module (PSM) and a Central Routing Adapter (CRA). Each chip or sub-module in an MCM will go through the PSM that re-arranges the node connection sequence by means of a horizontal-vertical matrix prior to the connection to the CRA. The CRA provides direct point-to-point connections based on the netlist for all chips or sub-modules in the MCM. The set of connections between the nodes of two chips (or sub-modules) is defined as a connection relationship. The number of connection relationships is n(n-1)/2, where n is the number of chips or sub-modules. By this approach, maximum number of layers in the CRA to route all connections among the chips or sub-modules will be (n-2). The design and development of these PSM and CRA are elaborated, and a 4-chip MCM example is used for illustration.\",\"PeriodicalId\":166931,\"journal\":{\"name\":\"Proceedings of 1st International Conference on Conventional and Knowledge Based Intelligent Electronic Systems. KES '97\",\"volume\":\"76 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-05-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1st International Conference on Conventional and Knowledge Based Intelligent Electronic Systems. KES '97\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/KES.1997.616917\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1st International Conference on Conventional and Knowledge Based Intelligent Electronic Systems. KES '97","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/KES.1997.616917","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文提出了一种结构化的多芯片模块(mcm)路由方法,适用于EDA系统,无论连接密度如何,都可以保证100%完成路由。它使用了一种相当简单直接的模块化方法,不仅保证了100%的路线完成,而且还优化和预先确定了所需的层数。这种方法是使用预排序模块(PSM)和中央路由适配器(CRA)构建的。在连接到CRA之前,MCM中的每个芯片或子模块将通过PSM通过水平-垂直矩阵重新排列节点连接顺序。CRA基于网络列表为MCM中的所有芯片或子模块提供直接的点对点连接。两个芯片(或子模块)节点之间的连接集定义为连接关系。连接关系的个数为n(n-1)/2,其中n为芯片或子模块的个数。通过这种方法,CRA中路由芯片或子模块之间所有连接的最大层数将是(n-2)。并以一个4片MCM为例,详细阐述了PSM和CRA的设计与开发。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A structured approach for routing of MCMs
This paper presents a structured methodology for routing of multichip modules (MCMs) suitable for an EDA system that can guarantee 100% completion of routes irrespective of connection density. It uses a rather simple and straightforward modularized approach which, not only guarantees 100% completion of routes, but also optimizes and predetermines the number of layers required. This approach is structured using a Pre-sorter Module (PSM) and a Central Routing Adapter (CRA). Each chip or sub-module in an MCM will go through the PSM that re-arranges the node connection sequence by means of a horizontal-vertical matrix prior to the connection to the CRA. The CRA provides direct point-to-point connections based on the netlist for all chips or sub-modules in the MCM. The set of connections between the nodes of two chips (or sub-modules) is defined as a connection relationship. The number of connection relationships is n(n-1)/2, where n is the number of chips or sub-modules. By this approach, maximum number of layers in the CRA to route all connections among the chips or sub-modules will be (n-2). The design and development of these PSM and CRA are elaborated, and a 4-chip MCM example is used for illustration.
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