航空航天应用中的无铅微电子装配

A. Shapiro, J. Bonner, O. Ogunseitan, J.-D.M. Shphores, J. Schoenung
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引用次数: 0

摘要

商用微电子工业正在迅速实施无铅组装战略。这一趋势是由欧洲和日本现有的和拟议的立法推动的,这些立法已经导致许多公司(包括AT&T、IBM、摩托罗拉、惠普和英特尔)采用无pb实施计划。这是微电子工业真正全球化的又一迹象。在摩尔定律的指引下,微电子技术的发展十分迅速,但并不一致:在许多情况下,商业工业在技术上领先于航空航天领域。商业工业的进步,以及成本,推动了商用现货(COTS)部件在军事和空间应用中的使用。因此,我们可以预见,航天工业将被迫使用无铅组件和子系统作为其标准业务实践的一部分。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Pb-free microelectronics assembly in aerospace applications
The commercial microelectronics industry is rapidly implementing Pb-free assembly strategy. This trend is driven by existing and proposed legislation in Europe and Japan, which has already led a number of firms (including AT&T, IBM, Motorola, HP and Intel) to adopt Pb-free implementation programs. This is another sign that the microelectronics industry has become truly global. Following Moore's law, progress in microelectronics is brisk but not uniform: in many cases, commercial industry is ahead of the aerospace sector in technology. Progress by commercial industry, along with cost, drives the use of Commercial Off-The-Shelf (COTS) parts for military and space applications. We can thus anticipate that the aerospace industry, would be forced to use Pb-free components and subsystems as part of their standard business practices.
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