{"title":"利用氧化铜粒子光子烧结制备互连","authors":"Po-Hsiang Chiu, Jenn-Ming Song","doi":"10.23919/ICEP.2019.8733454","DOIUrl":null,"url":null,"abstract":"Hybrid pastes containing copper oxide particles with nano-(NPO) and submicron sizes (SMPO) were successfully developed for conductor fabrication through photonic sintering. Subjected to 3 or 4 flash pulses, copper particle pastes can be transformed into conductive sintered structure. A optimal SMPO:NPO ratio of 3:1 to obtain low electrical resistivity was suggested. The additions of copper formate can further reduce the resistivity down to 64.6±5.7μΩ•cm. FTIR spectra indicate that copper formate is easier to dissociate by flash irradiation compared to cupric sulfate and cupric chloride. One of the salt dissociation products, metallic copper, contributes to better electrical conductance","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interconnect Fabrication using Copper Oxide Particles by Photonic-sintering\",\"authors\":\"Po-Hsiang Chiu, Jenn-Ming Song\",\"doi\":\"10.23919/ICEP.2019.8733454\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Hybrid pastes containing copper oxide particles with nano-(NPO) and submicron sizes (SMPO) were successfully developed for conductor fabrication through photonic sintering. Subjected to 3 or 4 flash pulses, copper particle pastes can be transformed into conductive sintered structure. A optimal SMPO:NPO ratio of 3:1 to obtain low electrical resistivity was suggested. The additions of copper formate can further reduce the resistivity down to 64.6±5.7μΩ•cm. FTIR spectra indicate that copper formate is easier to dissociate by flash irradiation compared to cupric sulfate and cupric chloride. One of the salt dissociation products, metallic copper, contributes to better electrical conductance\",\"PeriodicalId\":213025,\"journal\":{\"name\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP.2019.8733454\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733454","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interconnect Fabrication using Copper Oxide Particles by Photonic-sintering
Hybrid pastes containing copper oxide particles with nano-(NPO) and submicron sizes (SMPO) were successfully developed for conductor fabrication through photonic sintering. Subjected to 3 or 4 flash pulses, copper particle pastes can be transformed into conductive sintered structure. A optimal SMPO:NPO ratio of 3:1 to obtain low electrical resistivity was suggested. The additions of copper formate can further reduce the resistivity down to 64.6±5.7μΩ•cm. FTIR spectra indicate that copper formate is easier to dissociate by flash irradiation compared to cupric sulfate and cupric chloride. One of the salt dissociation products, metallic copper, contributes to better electrical conductance
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