用PIC单片机控制焊接过程的冷却速度

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887633

T. Garami, Norbert Reti, O. Krammer

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引用次数: 1

摘要

本文主要研究焊接过程中的冷却速度。我们的目标是创建一个控制良好的设备，用于设置三个特殊部分的可调节冷却曲线的斜率。这三个部分分别是:熔点附近、熔点以上和熔点以下。该机组使用冷却风扇来产生强制对流气流。温度反馈回路中的温度测量采用k型热电偶。冷却速度可在0.25 K/s至10 K/s之间进行宽范围调节。为了了解不同冷却速率的影响，必须研究焊料固相点附近的过冷机制。实验表明，当焊料在冷却过程中达到固相点时，在温度分布中存在一个平坦的截面。有了控制装置，这种现象和不同冷却速率的影响也可以被研究。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Controlling the cooling rate of soldering processes with PIC microcontroller

This paper focuses on the cooling rate of soldering process. Our target was to create a well-controlled equipment that is used to set the adjustable slope of the cooling curve with three special sections. The three sections are: near the melting point, above and below the melting point. The unit uses cooling fans to create a forced convection air flow. K-type thermocouple is used for the temperature measurement in the temperature feedback loop. The cooling rate is adjustable in a wide range, between 0.25 K/s and 10 K/s. To understand the effect of different cooling rates, the undercooling mechanism near the solidus point of the solder has to be investigated. Experiments showed that there is a flat section in the temperature profile when the solder reaches the solidus point during cooling. With the control unit this phenomenon and the effect of various cooling rates can also be investigated.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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