光学互连电子芯片:技术的教程和回顾

M. G. Forbes, J. Gourlay, M. Desmulliez
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引用次数: 109

摘要

半导体工业协会(SIA)路线图已将超大规模集成电路芯片之间的光电互连确定为克服超大规模集成电路芯片之间通信带宽瓶颈的少数解决方案之一。基于光互连的大规模演示,在全面运行时,今天可以展示与2007年路线图所预见的相同的总带宽。大规模并行性、长距离低输入/输出驱动能量以及数百个光信息输入通道的同步处理意味着这些原型可以潜在地提供在太针hz区域的开/关通信速率(即总容量为1太比特/秒)。在讨论了电互连的局限性之后,本文综述了光电元件与VLSI芯片集成的方法、合适的光电器件类型以及构建光数据链路的三种主要方法:光纤带、平面波导和自由空间光学。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optically interconnected electronic chips: a tutorial and review of the technology
Optoelectronic interconnects between VLSI chips have been identified by the Semiconductor Industry Association (SIA) Roadmap as one of the few solutions to overcoming the communication bandwidth bottleneck between VLSI chips. Large-scale demonstrators based on optical interconnects, when fully operational, can exhibit today the same aggregate bandwidth as that foreseen by the Roadmap for the year 2007. Massive parallelism, low input/output driving energy over large distances, and synchronous processing of hundreds of optical information input channels mean that these prototypes can potentially provide on/off communication rates in the tera-pin-Hz region (i.e., a total capacity of one terabit/s). After discussing the limitations of electrical interconnects this paper reviews the means of integrating optoelectronic components with VLSI chips, suitable types of optoelectronic device and the three main approaches to constructing optical data links: fibre-ribbons, planar waveguides and free-space optics.
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