{"title":"0.5T0.5R -介绍一种由共享石墨烯边触点和h-BN绝缘体实现的超紧凑存储电池","authors":"C. Yeh, Dujiao Zhang, W. Cao, K. Banerjee","doi":"10.1109/IEDM13553.2020.9371902","DOIUrl":null,"url":null,"abstract":"In this work, we experimentally demonstrate, in a manufacture-friendly process, a hybrid memory device to replace the traditional 1T1R memory unit that is composed of one-transistor and one-resistive-random-access-memory (RRAM), i.e., two separate devices. This novel device, which can be considered as a 0.5T0.5R memory cell, is structurally enabled by utilizing the unique graphene edge-contact and resistively switchable hexagonal boron nitride (h-BN) insulator. Aided by design optimization, record performance (<10 ns switching-speed), energy- (~0.07 pJ/bit) and area- efficiency (smallest footprint among all reported 2D RRAM memory units), as well as great retention (106 s) and endurance (>1000), have been achieved by this 0.5T0.5R memory cell. Moreover, the observed cell-resistance’s fine-tunability with ultrashort pulse count, pulse amplitude, and gate voltage uncovers the potential of this device for neuromorphic and in-memory computing.","PeriodicalId":415186,"journal":{"name":"2020 IEEE International Electron Devices Meeting (IEDM)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"0.5T0.5R - Introducing an Ultra-Compact Memory Cell Enabled by Shared Graphene Edge-Contact and h-BN Insulator\",\"authors\":\"C. Yeh, Dujiao Zhang, W. Cao, K. Banerjee\",\"doi\":\"10.1109/IEDM13553.2020.9371902\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, we experimentally demonstrate, in a manufacture-friendly process, a hybrid memory device to replace the traditional 1T1R memory unit that is composed of one-transistor and one-resistive-random-access-memory (RRAM), i.e., two separate devices. This novel device, which can be considered as a 0.5T0.5R memory cell, is structurally enabled by utilizing the unique graphene edge-contact and resistively switchable hexagonal boron nitride (h-BN) insulator. Aided by design optimization, record performance (<10 ns switching-speed), energy- (~0.07 pJ/bit) and area- efficiency (smallest footprint among all reported 2D RRAM memory units), as well as great retention (106 s) and endurance (>1000), have been achieved by this 0.5T0.5R memory cell. Moreover, the observed cell-resistance’s fine-tunability with ultrashort pulse count, pulse amplitude, and gate voltage uncovers the potential of this device for neuromorphic and in-memory computing.\",\"PeriodicalId\":415186,\"journal\":{\"name\":\"2020 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM13553.2020.9371902\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM13553.2020.9371902","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
0.5T0.5R - Introducing an Ultra-Compact Memory Cell Enabled by Shared Graphene Edge-Contact and h-BN Insulator
In this work, we experimentally demonstrate, in a manufacture-friendly process, a hybrid memory device to replace the traditional 1T1R memory unit that is composed of one-transistor and one-resistive-random-access-memory (RRAM), i.e., two separate devices. This novel device, which can be considered as a 0.5T0.5R memory cell, is structurally enabled by utilizing the unique graphene edge-contact and resistively switchable hexagonal boron nitride (h-BN) insulator. Aided by design optimization, record performance (<10 ns switching-speed), energy- (~0.07 pJ/bit) and area- efficiency (smallest footprint among all reported 2D RRAM memory units), as well as great retention (106 s) and endurance (>1000), have been achieved by this 0.5T0.5R memory cell. Moreover, the observed cell-resistance’s fine-tunability with ultrashort pulse count, pulse amplitude, and gate voltage uncovers the potential of this device for neuromorphic and in-memory computing.