SEVERAL SPUTTERING PARAMETERS AFFECTING THIN FILM DEPOSITION

Sputtering is a technique used for thin film deposition on different substrates for centuries. In this technique, the source atoms or electrons are bombarded on the target material that sputters target metal atoms. The emitted target atoms are deposited on the substrate in the form of thin films. Several sputtering parameters control the rate at which films are deposited. These sputtering parameters include voltage applied, sputter yield, type of the gas used, type of the target material used, type of the substrate on which the thin films are to be deposited, the working pressure of the system, power, temperature of the system and substrate, angle of incidence of bombardment and distance between target and substrate. These parameters are essential to have thin films of desired thickness and properties. These properties include electrical properties, thermal properties, optical properties and chemical properties as well.