{"title":"氮在短垂直表面上的对流沸腾","authors":"T. Crowley, R. Tuzla, L. Wenzel, J.C. Chen","doi":"10.1109/ITHERM.1988.28691","DOIUrl":null,"url":null,"abstract":"Convective nucleate boiling heat transfer from a plane vertical surface to nitrogen in two-phase flow is discussed. A 6.3-mm diameter heat source was used to represent a single semiconductor chip or chip carrier. Experiments were performed to study the parametric effects of vapor quality and flow rate on the heat transfer coefficient.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Convective boiling of nitrogen on a short vertical surface\",\"authors\":\"T. Crowley, R. Tuzla, L. Wenzel, J.C. Chen\",\"doi\":\"10.1109/ITHERM.1988.28691\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Convective nucleate boiling heat transfer from a plane vertical surface to nitrogen in two-phase flow is discussed. A 6.3-mm diameter heat source was used to represent a single semiconductor chip or chip carrier. Experiments were performed to study the parametric effects of vapor quality and flow rate on the heat transfer coefficient.<<ETX>>\",\"PeriodicalId\":226424,\"journal\":{\"name\":\"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1988-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.1988.28691\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.1988.28691","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Convective boiling of nitrogen on a short vertical surface
Convective nucleate boiling heat transfer from a plane vertical surface to nitrogen in two-phase flow is discussed. A 6.3-mm diameter heat source was used to represent a single semiconductor chip or chip carrier. Experiments were performed to study the parametric effects of vapor quality and flow rate on the heat transfer coefficient.<>