变Sc含量AlScN薄Ulms在200mm晶圆上的反应溅射

M. Clement, V. Felmetsger, T. Mirea, E. Iborra
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引用次数: 3

摘要

随着Sc含量的增加,掺Sc的AlN多晶薄膜的压电活性显著增大,是高频(GHz范围)声谐振器中有吸引力的有源层。为了在200毫米硅片上溅射均匀掺杂的AlScN薄膜,我们使用了一个可配置的阴极,其中包含可变数量的嵌入Sc颗粒,以微调薄膜中的Sc含量。该方法是在OEM集团的Endeavor-AT™集群工具中实现的,适用于200 mm晶圆上的溅射。1 μm厚的AlScN薄膜具有均匀的Sc含量(约7at .%),高晶体质量和良好的压电响应,已在200 mm的生产级晶圆上溅射。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reactive sputtering of AlScN thin Ulms with variable Sc content on 200 mm wafers
Sc-doped AlN polycrystalline films are attractive active layers for high frequency (GHz range) acoustic resonators owing to the significant enlargement of the AlN piezoelectric activity with the increasing Sc content. To sputter homogenously doped AlScN films on 200 mm Si wafers we use a configurable cathode containing a variable number of embedded Sc pellets to fine tuning the Sc content in the films. The method was implemented in an Endeavor-AT™ cluster tool from OEM Group, adapted for sputtering on 200 mm wafers. 1 μm thick AlScN films with uniform Sc content (around 7 at.%), high crystal quality and good piezoelectric response have been sputtered over 200 mm production-level wafers.
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