M. Zaborowski, A. Baraniecka, J. Zajac, K. Domanski, P. Grabiec
{"title":"薄膜双电极阻抗传感器的研制与测试","authors":"M. Zaborowski, A. Baraniecka, J. Zajac, K. Domanski, P. Grabiec","doi":"10.1117/12.2244502","DOIUrl":null,"url":null,"abstract":"A flexible thin film impedance sensor has been developed. Device manufacturing process and preparation of test wafers are described. Sensors with ring shaped Au electrodes have been fabricated on a polyimide substrate using Si wafer as a temporary substrate. The sensors have been characterized by means of Agilent 4294A analyzer and tested in measurements of impedance of human skin, Si wafers and other materials. Results of indirect measurements of samples covered with dielectric layer (SU-8, glass) confirm advantages of the sensors.","PeriodicalId":101814,"journal":{"name":"Scientific Conference on Optical and Electronic Sensors","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thin film two-electrode impedance sensor development and tests\",\"authors\":\"M. Zaborowski, A. Baraniecka, J. Zajac, K. Domanski, P. Grabiec\",\"doi\":\"10.1117/12.2244502\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A flexible thin film impedance sensor has been developed. Device manufacturing process and preparation of test wafers are described. Sensors with ring shaped Au electrodes have been fabricated on a polyimide substrate using Si wafer as a temporary substrate. The sensors have been characterized by means of Agilent 4294A analyzer and tested in measurements of impedance of human skin, Si wafers and other materials. Results of indirect measurements of samples covered with dielectric layer (SU-8, glass) confirm advantages of the sensors.\",\"PeriodicalId\":101814,\"journal\":{\"name\":\"Scientific Conference on Optical and Electronic Sensors\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-11-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Scientific Conference on Optical and Electronic Sensors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2244502\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Scientific Conference on Optical and Electronic Sensors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2244502","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thin film two-electrode impedance sensor development and tests
A flexible thin film impedance sensor has been developed. Device manufacturing process and preparation of test wafers are described. Sensors with ring shaped Au electrodes have been fabricated on a polyimide substrate using Si wafer as a temporary substrate. The sensors have been characterized by means of Agilent 4294A analyzer and tested in measurements of impedance of human skin, Si wafers and other materials. Results of indirect measurements of samples covered with dielectric layer (SU-8, glass) confirm advantages of the sensors.
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