通过透明电极观察ECM间隙现象

Wenhao Zhang, Tomoo Kitamura, M. Kunieda, K. Abe
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引用次数: 9

摘要

电解加工(ECM)过程中,电极间隙内会产生气泡和污泥,严重影响加工精度。为了解决这个问题,电解质流被供应到间隙中以冲走它们。因此,本研究旨在使用透明电极观察间隙中电解质和气泡的流动情况。由于碳化硅单晶半导体具有导电性和光学透明性,因此被用作正极材料。利用高速摄像机通过碳化硅阴极观察到与电极表面垂直方向的间隙。研究了气泡流速和气泡直径的分布,了解了冲洗流量对加工过程的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Observation of ECM Gap Phenomena through Transparent Electrode
During the process of electrochemical machining (ECM), bubbles and sludge are generated in the inter electrode gap, affecting the machining accuracy significantly. To solve this problem, an electrolyte flow is supplied into the gap to flush them away. Hence, this study aimed to observe the flow of electrolyte and bubbles in the gap using a transparent electrode. SiC single crystal semiconductor was used as the cathode material because it is electrically conductive and optically transparent. The gap was observed through the SiC cathode in the direction normal to the electrode surface using a high speed video camera. Distr ibutions of the flow speed and diameter of bubbles were investigated to understand the influence of flushing flow on the machining process.
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