下填料对功能性倒装芯片机械和电气性能的影响

Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) Pub Date : 1997-10-26 DOI:10.1109/PEP.1997.656499

J. Lau, C. Chang, R. Chen

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引用次数: 17

摘要

测定了四种不同填充填料在不同尺寸、填料和环氧树脂含量下的固化条件和材料的热膨胀系数、玻璃化转变温度、杨氏模量、含水率等性能。研究了这些衬底对有机衬底上凸焊功能倒装芯片的流速、机械性能和电性能的影响。

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Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device

The curing conditions and material properties such as the coefficient of thermal expansion, glass transition temperature, Young's modulus, and moisture content of four different underfill encapsulants with different size and content of filler and epoxy are measured. The effects of these underfills on the flow rate, mechanical performance, and electrical performance of a solder-bumped functional flip chip on an organic substrate are studied.

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Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)

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