从微带矩法计算中去除包效应

1992 IEEE Microwave Symposium Digest MTT-S Pub Date : 1992-06-01 DOI:10.1109/MWSYM.1992.188220

R. Jackson

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引用次数: 8

摘要

微带电路的电磁性能通常取决于电路周围的封装。如果封装的电容量很大，这一点尤其正确。讨论了阻尼外壳对单片微波集成电路建模和操作的重要性，提出了一种阻尼外壳的方法，并概述了一种应用矩量法来确定封装效应在全波仿真中的重要性的有效技术。

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Removing package effects from microstrip moment method calculations

The electromagnetic behavior of microstrip circuits often depends on the package that surrounds the circuit. This is especially true if the package is electrically large. The importance of a damped enclosure for modeling and operating MMIC (monolithic microwave IC) circuits is discussed, a method of damping enclosures is presented, and an efficient technique for applying the method of moments so as to determine the significance of the package effects on full-wave simulations is outlined.<>

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1992 IEEE Microwave Symposium Digest MTT-S

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