封装led的热成像

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2011-03-20 DOI:10.1109/STHERM.2011.5767216

D. Kendig, K. Yazawa, A. Shakouri

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引用次数: 17

摘要

利用热反射成像技术获得封装LED阵列和元件的二维温度图，其空间分辨率为亚微米级。典型的LED封装对于红外光是不透明的，这阻碍了红外摄像机和热电偶对半导体芯片的直接测量。采用百万像素硅CCD锁相瞬态成像技术同时获取热反射和电致发光信号。对模具不同位置的瞬态热响应进行了表征。观察到不同的热时间常数对应于不同的传热机制。

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Thermal imaging of encapsulated LEDs

Thermoreflectance imaging is used to obtain 2D temperature maps of encapsulated LED arrays and elements with sub-micron spatial resolution. Typical LED encapsulation is opaque for infrared light, which prevents direct measurement of the semiconductor die with infrared cameras and thermocouples. A lock-in transient imaging technique with a megapixel silicon CCD is used to obtain the thermoreflectance and electroluminescence signals simultaneously. Transient thermal response in different locations of the die is characterized. Different thermal time constants are observed which correspond to various heat transfer mechanisms.

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2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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