UV-LIGA:一种有前途的低成本微系统技术变体

1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140) Pub Date : 1998-12-14 DOI:10.1109/COMMAD.1998.791668

W. Qu, C. Wenzel, A. Jahn, D. Zeidler

{"title":"UV-LIGA:一种有前途的低成本微系统技术变体","authors":"W. Qu, C. Wenzel, A. Jahn, D. Zeidler","doi":"10.1109/COMMAD.1998.791668","DOIUrl":null,"url":null,"abstract":"A low-cost surface microstructuring technique is described and examples provided of its recent application. The new technology, UV-LIGA combines depth UV lithographic patterning of very thick photoresists and electrodepositing of structural materials into the patterned resist moulds. Both UV lithography and electrodeposition do not need any expensive or special equipment. Movable three dimensional microstructures with a high aspect ratio can be obtained by combining the UV-LIGA process with a sacrificial layer technique. As an example of the advanced application in microsystems, fabrication of 3D accelerometers has been presented, using titanium as a sacrificial layer and nickel as the structural material.","PeriodicalId":300064,"journal":{"name":"1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140)","volume":"149 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"27","resultStr":"{\"title\":\"UV-LIGA: a promising and low-cost variant for microsystem technology\",\"authors\":\"W. Qu, C. Wenzel, A. Jahn, D. Zeidler\",\"doi\":\"10.1109/COMMAD.1998.791668\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A low-cost surface microstructuring technique is described and examples provided of its recent application. The new technology, UV-LIGA combines depth UV lithographic patterning of very thick photoresists and electrodepositing of structural materials into the patterned resist moulds. Both UV lithography and electrodeposition do not need any expensive or special equipment. Movable three dimensional microstructures with a high aspect ratio can be obtained by combining the UV-LIGA process with a sacrificial layer technique. As an example of the advanced application in microsystems, fabrication of 3D accelerometers has been presented, using titanium as a sacrificial layer and nickel as the structural material.\",\"PeriodicalId\":300064,\"journal\":{\"name\":\"1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140)\",\"volume\":\"149 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-12-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"27\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/COMMAD.1998.791668\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/COMMAD.1998.791668","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 27

摘要

介绍了一种低成本的表面微结构技术，并举例说明了其最新应用。这项新技术，UV- liga结合了非常厚的光刻胶的深度UV光刻图案和结构材料的电沉积到图案的抗蚀剂模具中。UV光刻和电沉积都不需要任何昂贵或特殊的设备。将UV-LIGA工艺与牺牲层技术相结合，可获得高纵横比的可移动三维微结构。以钛为牺牲层，镍为结构材料，制备了三维加速度计，作为其在微系统中的先进应用实例。

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UV-LIGA: a promising and low-cost variant for microsystem technology

A low-cost surface microstructuring technique is described and examples provided of its recent application. The new technology, UV-LIGA combines depth UV lithographic patterning of very thick photoresists and electrodepositing of structural materials into the patterned resist moulds. Both UV lithography and electrodeposition do not need any expensive or special equipment. Movable three dimensional microstructures with a high aspect ratio can be obtained by combining the UV-LIGA process with a sacrificial layer technique. As an example of the advanced application in microsystems, fabrication of 3D accelerometers has been presented, using titanium as a sacrificial layer and nickel as the structural material.

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1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140)

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