阶跃结构RF MEMS穿孔并联开关电容建模研究

K. G. Sravani, K. Guha, K. S. Rao
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引用次数: 3

摘要

本文研究了阶跃结构非均匀弯曲型电容式射频MEMS分流开关的电容建模。采用在阶跃结构梁中引入穿孔的新策略,减小了边缘场电容,提高了开关速度。利用有限元仿真工具对该开关进行了仿真验证,并将上、下状态电容的仿真结果与解析结果进行了比较。我们的结果表明,所提出的电容模型击败了现有的卫星应用模型。通过改变梁的厚度和韧带的效率来估计和分析误差。所提出的阶跃结构开关的光束厚度为1.5um,介质厚度最小,与电容建模的基准模型相比,该器件的韧带效率为$\mu=0.38$。该分析模型在1.5μm的桥面厚度下取得了很好的效果,估计误差在0.2 ~ 2%之间。根据所提出的模型计算并验证了电容的两个基准模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Investigation on Capacitance Modeling of Step Strcture RF MEMS Perforated Shunt Switch
This paper presents the study of capacitance modeling of step structured non-uniform meander based capacitive RF MEMS shunt switch with etched holes on the beam. A new strategy of introducing perforation in the step structure beam minimizes the fringing field capacitance and enhances the switching speed. The switch is simulated using FEM tool for validation and the simulated results of upstate and down state capacitance is compared to the analytical results. Our outcomes reveal that proposed capacitance model defeats the existing models for satellite applications. The errors are estimated and analyzed by varying beam thickness and ligament efficiency. The proposed step structured switch having beam thickness of 1.5um with the minimal dielectric thickness results in high performance of the device with ligament efficiency of $\mu=0.38$ comparing with the benchmark models for capacitance modelling. The proposed analytical model shows extraordinary accomplishment for higher bridge thickness of 1.5μm with an estimation of 0.2-2% error. Two bench mark models of capacitance are calculated and validated against the proposed model.
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