预非晶硅低温退火过程中掺杂剂重分布效应

V. Venezia, R. Duffy, L. Pelaz, M. Aboy, A. Heringa, P. Griffin, C. Wang, M. Hopstaken, Y. Tamminga, T. Dao, B. Pawlak, F. Roozeboom
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引用次数: 5

摘要

在适用于sub-65 nm CMOS技术的条件下,监测了B、As和In掺杂在固相外延再生(SPER)过程中和之后的时间演变。在SPER过程中,通过对再生界面的扫描使As和In分离。对于B,在SPER过程中,B在a-Si中发生了明显的扩散,而在SPER之后,B的上坡扩散占主导地位。借助原子模拟,我们确定了达到最大上坡B扩散的温度依赖时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dopant redistribution effects in preamorphized silicon during low temperature annealing
The time evolution of B, As, and In doping profiles during and after solid phase epitaxial regrowth (SPER) was monitored for conditions applicable to sub-65 nm CMOS technologies. As and In segregate during SPER by a sweep of the regrowing interface. In the case of B, significant B diffusion in a-Si occurs during SPER, while afterwards B uphill diffusion dominates. With the aid of atomistic simulation we have identified a temperature dependent time to maximum uphill B diffusion.
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