低温共烧陶瓷在密闭包装中的应用

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887571

M. Klíma, J. Somer, L. Blahová, M. Procházka, I. Szendiuch

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引用次数: 1

摘要

本文论述了低温共烧陶瓷作为裸模密封封装材料的应用。测量两种类型的基材-贺利氏纹路2000和杜邦GreenTape 951PT。为了获得更准确的结果，设计了不同的过孔阵列来模拟封装中的导电接头。通过测量氧透射率来确定样品的气密性。研究了气密性与材料厚度和通孔数量的关系。还包括样品的设计和制造以及测量说明。本实验的结果比较了上述几种陶瓷，为气密包装的设计奠定了知识基础。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Usage of low-temperature co-fired ceramic in hermetic packaging

This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured - Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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