{"title":"高压/高温电力电子封装用先进材料的表征","authors":"D. Hopkins, J. Bowers","doi":"10.1109/APEC.2001.912498","DOIUrl":null,"url":null,"abstract":"To achieve high reliability in next generation dense, high voltage (>1 kV DC), high temperature (200/spl deg/C to 400/spl deg/C) power electronic circuits, packaging techniques from higher voltage systems (5 kV-50 kV) need to be introduced. This paper describes advanced materials, measurement and characterization techniques for this class of systems. These systems are being developed for commercial, industrial and military applications that include supplies, drives and actuators. The results are applicable to 1200 V+IGBT based module designs.","PeriodicalId":201844,"journal":{"name":"APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Characterization of advanced materials for high voltage/high temperature power electronics packaging\",\"authors\":\"D. Hopkins, J. Bowers\",\"doi\":\"10.1109/APEC.2001.912498\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To achieve high reliability in next generation dense, high voltage (>1 kV DC), high temperature (200/spl deg/C to 400/spl deg/C) power electronic circuits, packaging techniques from higher voltage systems (5 kV-50 kV) need to be introduced. This paper describes advanced materials, measurement and characterization techniques for this class of systems. These systems are being developed for commercial, industrial and military applications that include supplies, drives and actuators. The results are applicable to 1200 V+IGBT based module designs.\",\"PeriodicalId\":201844,\"journal\":{\"name\":\"APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181)\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-03-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEC.2001.912498\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.2001.912498","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Characterization of advanced materials for high voltage/high temperature power electronics packaging
To achieve high reliability in next generation dense, high voltage (>1 kV DC), high temperature (200/spl deg/C to 400/spl deg/C) power electronic circuits, packaging techniques from higher voltage systems (5 kV-50 kV) need to be introduced. This paper describes advanced materials, measurement and characterization techniques for this class of systems. These systems are being developed for commercial, industrial and military applications that include supplies, drives and actuators. The results are applicable to 1200 V+IGBT based module designs.
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