弯曲速度和设置对多层陶瓷电容器弯曲裂纹的影响

2017 IEEE 11th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED) Pub Date : 2017-08-01 DOI:10.1109/DEMPED.2017.8062417

C. Andersson, O. Kristensen, E. Varescon, F. Iannuzzo

{"title":"弯曲速度和设置对多层陶瓷电容器弯曲裂纹的影响","authors":"C. Andersson, O. Kristensen, E. Varescon, F. Iannuzzo","doi":"10.1109/DEMPED.2017.8062417","DOIUrl":null,"url":null,"abstract":"A comparison of bending speed and experimental setups using 3-point or 4-point bending for introduction of flex cracks into multilayer ceramic capacitors (MLCCs) in a controlled manner is presented. The impact of bending speed and corresponding strain rates on the formed flex cracks detected by X-ray imaging and optical microscopy images of cross-sectioned MLCCs are examined. Furthermore, the critical strain levels of cracked MLCCs mounted in different orientations as compared to the applied strain are compared for quick and standard bending as well as for a 3-point and 4-point bending test setup.","PeriodicalId":325413,"journal":{"name":"2017 IEEE 11th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Impact of bending speed and setup on flex cracks in multilayer ceramic capacitors\",\"authors\":\"C. Andersson, O. Kristensen, E. Varescon, F. Iannuzzo\",\"doi\":\"10.1109/DEMPED.2017.8062417\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A comparison of bending speed and experimental setups using 3-point or 4-point bending for introduction of flex cracks into multilayer ceramic capacitors (MLCCs) in a controlled manner is presented. The impact of bending speed and corresponding strain rates on the formed flex cracks detected by X-ray imaging and optical microscopy images of cross-sectioned MLCCs are examined. Furthermore, the critical strain levels of cracked MLCCs mounted in different orientations as compared to the applied strain are compared for quick and standard bending as well as for a 3-point and 4-point bending test setup.\",\"PeriodicalId\":325413,\"journal\":{\"name\":\"2017 IEEE 11th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED)\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE 11th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DEMPED.2017.8062417\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 11th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DEMPED.2017.8062417","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

在可控的情况下，采用3点或4点弯曲引入多层陶瓷电容器(mlcc)的弯曲速度和实验设置进行了比较。通过x射线成像和光学显微镜图像检测了弯曲速度和相应的应变速率对弯曲裂纹形成的影响。此外，与应用应变相比，安装在不同方向的裂纹mlcc的临界应变水平在快速弯曲和标准弯曲以及3点和4点弯曲测试装置中进行了比较。

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Impact of bending speed and setup on flex cracks in multilayer ceramic capacitors

A comparison of bending speed and experimental setups using 3-point or 4-point bending for introduction of flex cracks into multilayer ceramic capacitors (MLCCs) in a controlled manner is presented. The impact of bending speed and corresponding strain rates on the formed flex cracks detected by X-ray imaging and optical microscopy images of cross-sectioned MLCCs are examined. Furthermore, the critical strain levels of cracked MLCCs mounted in different orientations as compared to the applied strain are compared for quick and standard bending as well as for a 3-point and 4-point bending test setup.

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2017 IEEE 11th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED)

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