{"title":"片上电感和变压器设计中损耗硅衬底的精确建模","authors":"X. Huo, K.J. Chen, H. Luong, P. Chan","doi":"10.1109/RFIC.2004.1320699","DOIUrl":null,"url":null,"abstract":"A physical based lumped element model is developed for lossy silicon substrates, considering both electric loss and eddy current loss induced by the substrate. A simplified ladder structure is used to accurately model the skin effect of the high conductivity silicon substrate. Good agreement with a full wave solver is obtained for inductors on different resistivity silicon substrates.","PeriodicalId":140604,"journal":{"name":"2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers","volume":"139 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Accurate modeling of lossy silicon substrate for on-chip inductors and transformers design\",\"authors\":\"X. Huo, K.J. Chen, H. Luong, P. Chan\",\"doi\":\"10.1109/RFIC.2004.1320699\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A physical based lumped element model is developed for lossy silicon substrates, considering both electric loss and eddy current loss induced by the substrate. A simplified ladder structure is used to accurately model the skin effect of the high conductivity silicon substrate. Good agreement with a full wave solver is obtained for inductors on different resistivity silicon substrates.\",\"PeriodicalId\":140604,\"journal\":{\"name\":\"2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers\",\"volume\":\"139 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-06-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RFIC.2004.1320699\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIC.2004.1320699","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Accurate modeling of lossy silicon substrate for on-chip inductors and transformers design
A physical based lumped element model is developed for lossy silicon substrates, considering both electric loss and eddy current loss induced by the substrate. A simplified ladder structure is used to accurately model the skin effect of the high conductivity silicon substrate. Good agreement with a full wave solver is obtained for inductors on different resistivity silicon substrates.