用光- cvd法生长氮化磷膜的InP MIS结构

Y. Jeong, J. Lee, Y. Hong, Y. Bae
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引用次数: 1

摘要

利用PCl/sub 3/和NH/sub 3/混合气体,用直接光-气相沉积法在InP表面实现了氮化磷(P/sub 3/N/sub 5/)的低温(100-200℃)生长。薄膜的电阻率为1*10/sup 14/ ω -cm,击穿电压为1*10/sup 7/ V/cm。原位预处理后的Al-P/sub - 3/N/sub - 5/-InP MIS结构界面阱态的最小密度约为3.6*10/sup 10/ cm/sup -2/ eV/sup -1/。在200℃和150℃的沉积温度下,x射线光电子和俄歇谱数据测定的深度剖面显示,O原子在P/sub 3/N/sub 5/ InP界面堆积,并向P/sub 3/N/sub 5/薄膜扩散。这些数据被用来评价薄膜和界面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
InP MIS structure with phosphorus-nitride film grown by photo-CVD
Low-temperature (100-200 degrees C) growth of phosphorus nitride (P/sub 3/N/sub 5/) on an InP surface has been achieved using a mixture of PCl/sub 3/ and NH/sub 3/ gases by a direct photo-CVD. The films have a resistivity of 1*10/sup 14/ Omega -cm and a breakdown voltage of 1*10/sup 7/ V/cm. The minimum density of interface trap states for the Al-P/sub 3/N/sub 5/-InP MIS structure after the in-situ pretreatment and postanneal is about 3.6*10/sup 10/ cm/sup -2/ eV/sup -1/ near the midgap of the InP. Depth profiles determined from X-ray photoelectron and Auger spectroscopy data at deposition temperatures of 200 degrees C and 150 degrees C, respectively, show that the O atoms pile up at the P/sub 3/N/sub 5//InP interface and diffuse toward the P/sub 3/N/sub 5/ film. The data are used to evaluate the film and the interface.<>
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