片上系统的低功耗设计方法

K. Roy, A. Raghunathan, S. Dey
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引用次数: 1

摘要

随着系统级集成的发展,整个系统可以集成在单个芯片上,半导体技术的进步,以及积极的上市时间、性能和成本要求导致了电子系统设计的范式转变。与此同时,从嵌入式系统芯片的使用中获益最多的应用,如便携式电信产品,对低功耗的需求越来越迫切。现代片上系统(soc)的特点是存在异构组件:数字组件(如cpu、dsp和多媒体核心)、网络接口、模拟组件(如RF收发器和ADC/DAC核心)、高速定制设计模块以及异步接口。片上系统的异质性,以及使用深亚微米技术的影响,使得高效低功耗soc的设计具有挑战性。本教程介绍了低功耗深亚微米系统芯片设计和分析中的挑战、提出的新方法和当前的工业实践。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low Power Design Methodologies for Systems-on-Chips
Advances in semiconductor technologies, and the aggressive time-to-market, performance, and cost requirements have led to a paradigm shift in electronic system design, with the evolution of system-level-integration allowing an entire system to be integrated on a single chip. At the same time, the applications which stand to benefit most from the use of embedded system-on-chips, like portable telecommunication products, have increasingly critical needs for low power consumption. Modern system-on-chips (SOCs) are characterized by the presence of heterogeneous components: digital components like CPUs, DSPs, and multimedia cores, network interfaces, analog components like RF transceivers and ADC/DAC cores, high-speed custom-designed blocks, as well as asynchronous interfaces. The heterogeneity of system-on-chips, along with the effects of the use of deep submicron technologies, makes design of efficient low-power SOCs challenging. This tutorial addresses the challenges, new methodologies proposed, and current industrial practices in the design and analysis of low-power deep-submicron system-on-chips.
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