{"title":"用于显示应用的迷你led互连可靠性","authors":"In-seok Kye, Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Ki-seok Jang, Y. Eom, Kwang-Seong Choi, Yong-Jun Oh","doi":"10.1109/ectc51906.2022.00190","DOIUrl":null,"url":null,"abstract":"Micro/Mini-LED displays have many advantages compared to other displays. However, the reliability data required for the commercialization of mini-LEDs is insufficient. In this study, we analyzed the reliability of mini-LEDs by comparing the shear strength and microstructure of their solder joints before and after conducting a reliability test. We first performed a simultaneous transfer and bonding (SITRAB) process to mount mini-LEDs on a substrate. To analyze the effect of underfill on mini-LED reliability, we compared those both with and without SITRAB adhesive. The mini-LED with SITRAB adhesive showed a small decrease in shear strength after the reliability test, whereas the mini-LED without SITRAB adhesive showed a large decrease in shear strength after the reliability test. As a result of measuring the optical characteristics of the LED after the reliability test, it was observed that there was no change in the characteristics of the mini-LED. It can be concluded that the SITRAB process with SITRAB adhesive improved the reliability of mini-LEDs.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interconnection Reliability of Mini LEDs for Display Applications\",\"authors\":\"In-seok Kye, Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Ki-seok Jang, Y. Eom, Kwang-Seong Choi, Yong-Jun Oh\",\"doi\":\"10.1109/ectc51906.2022.00190\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Micro/Mini-LED displays have many advantages compared to other displays. However, the reliability data required for the commercialization of mini-LEDs is insufficient. In this study, we analyzed the reliability of mini-LEDs by comparing the shear strength and microstructure of their solder joints before and after conducting a reliability test. We first performed a simultaneous transfer and bonding (SITRAB) process to mount mini-LEDs on a substrate. To analyze the effect of underfill on mini-LED reliability, we compared those both with and without SITRAB adhesive. The mini-LED with SITRAB adhesive showed a small decrease in shear strength after the reliability test, whereas the mini-LED without SITRAB adhesive showed a large decrease in shear strength after the reliability test. As a result of measuring the optical characteristics of the LED after the reliability test, it was observed that there was no change in the characteristics of the mini-LED. It can be concluded that the SITRAB process with SITRAB adhesive improved the reliability of mini-LEDs.\",\"PeriodicalId\":139520,\"journal\":{\"name\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ectc51906.2022.00190\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00190","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interconnection Reliability of Mini LEDs for Display Applications
Micro/Mini-LED displays have many advantages compared to other displays. However, the reliability data required for the commercialization of mini-LEDs is insufficient. In this study, we analyzed the reliability of mini-LEDs by comparing the shear strength and microstructure of their solder joints before and after conducting a reliability test. We first performed a simultaneous transfer and bonding (SITRAB) process to mount mini-LEDs on a substrate. To analyze the effect of underfill on mini-LED reliability, we compared those both with and without SITRAB adhesive. The mini-LED with SITRAB adhesive showed a small decrease in shear strength after the reliability test, whereas the mini-LED without SITRAB adhesive showed a large decrease in shear strength after the reliability test. As a result of measuring the optical characteristics of the LED after the reliability test, it was observed that there was no change in the characteristics of the mini-LED. It can be concluded that the SITRAB process with SITRAB adhesive improved the reliability of mini-LEDs.
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