LIDT testing as a tool for optimization of processing window for D263 glass sheet TGV treatment

Laser-Induced Deep Etching (LIDE) is considered as the one of the most promising techniques for production of so-called TGVs (Through Glass Vias). In the production process, thin glass sheet is treated with ultra-short lasers pulses to induce surface and volume modification, allowing efficient wet etching and formation of through hole. Precise knowledge of damage threshold of such glass is essential when optimizing the whole process and scaling up the production via laser beam parallelization. In following paper, we present recent results on LIDT measurement of D263 glass sheets at wavelengths 1030 nm and 515 nm, effective utilization of such knowledge for setting up multi-Bessel beam processing optics, and we demonstrate resulting substrates with TGVs.