一种新颖的80v HS-DMOS,具有渐进式resurf轮廓,可降低高侧操作的Ron_sp

Tsung-Yi Huang, Chien-Hao Huang, Chih-Fang Huang, Jing-Meng Liu, K. Lo, Chia-Hui Cheng, Jheng-Yi Jiang, T. Tsai, Ting-Wei Liao, J. Gong
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引用次数: 2

摘要

电源管理ic中工作在高侧(Ron_sp_HS)的DMOS的Ron sp通常在低侧(Ron_sp_LS)的测量值被低估。当在漂移区和衬底之间施加修正电压时,Ron_sp_HS急剧增加,因为漂移区耗尽并且电流路径变窄。本文通过在漏极下增加部分n型埋层(NBL),提出了一种在漂移区具有变结深度剖面的新型结构来抑制Ron_sp_HS的增加。在80V高侧操作下,HS-DMOS的漂移区会产生从沟道到漏极的逐渐掐断区,并且由于允许更宽的电子电流流过所提出结构中漂移区的中性区,因此Ron_sp_HS的增加百分比从128%抑制到79%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel 80 V HS-DMOS with gradual-RESURF profile to reduce Ron_sp for high-side operation
The Ron sp of a DMOS operated at high side (Ron_sp_HS) in the power management ICs is usually underestimated by taking the measured value at low side operation (Ron_sp_LS). The Ron_sp_HS is increased drastically when a revise voltage is applied between drift region and substrate because the drift-region is depleted and the current path is narrowed. In this paper, a novel structure with a varying-junction-depth profile in the drift region is proposed to suppress the increase of Ron_sp_HS by adding a partial n-type buried layer (NBL) under the drain region. The drift region of HS-DMOS will generate a gradual pinch-off region from channel to drain when it is operated at 80V under high side operations, and the increased percentage in Ron_sp_HS is suppressed from 128% to 79% because it allows a wider electron current flow through the neutral region of the drift region in the proposed structure.
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