W. Ho, M. Chang, S. Beccue, P. Zampardi, J. Yu, A. Sailer, R. Pierson, W.C. Wang
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引用次数: 16

摘要

GaAs biet LSI技术已成功开发用于低功耗,混合模式通信电路的应用。将场效应晶体管直接放置在HBT发射极帽层上,简化了器件外延生长和工艺集成。实现了高集成度和功能电路良率。优异的HBT和FET特性已经产生,FET的噪声系数与传统的mesfet相当,使它们能够在前端接收器应用中表现良好。通过这种技术,几个大规模集成电路,包括32位乘2位移位寄存器和单片DRFM已经成功演示。
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A GaAs BiFET LSI technology
A GaAs BiFET LSI technology has been successfully developed for low power, mixed mode communication circuit applications. The direct placement of the FET on the HBT emitter cap layer simplifies the device epitaxial growth and process integration. High integration levels and functional circuit yield have been achieved. Excellent HBT and FET characteristics have been produced with the noise figure of the FETs comparable to those of traditional MESFETs, enabling them to perform well in front end receiver applications. Through this technology, several LSI circuits, including 32-bit by 2-bit shift registers and a single-chip DRFM have been successfully demonstrated.
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