用于低相位噪声振荡器的衬底集成高q介电谐振器

Liang Zhou, W. Yin, J. Mao
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引用次数: 3

摘要

本文提出了一种利用多层印刷电路板(PCB)的衬底集成介质谐振器,用于低相位噪声振荡器等高性能微波封装系统。通孔柱作为金属边界墙,对电磁能量起到严格的限制作用,使介电包能够集成到多层PCB中。仿真结果表明,谐振腔在TE01δ模式下谐振,谐振频率在Ku波段。在工作频率下,介质谐振器的卸载Q约为14000。然而,由于多层PCB板中谐振器之间的高度限制,导致导电损耗增加,谐振器的空载Q降低到3500左右。为了改善振荡器的相位噪声,研制了多种介质谐振器,以找出最佳的空载Q和正确的频率。EM模拟和测量结果显示出非常接近的一致性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Substrate integrated high-Q dielectric resonators for low phase noise oscillator
This paper presents a substrate integrated dielectric resonators utilizing multilayer printed circuit boards (PCB) for high performance microwave system-on-package applications such as low phase noise oscillators. Via posts are used as for tightly confining electromagnetic energy as a metallic boundary wall so as the dielectric puck could be integrated into the multilayer PCB. The simulated results show that the resonator resonances at TE01δ mode with a frequency at Ku band. The unloaded Q of the dielectric resonator is around 14,000 at the operating frequency. However, because of the limitation of the height between of the resonator in the multilayer PCB, conductive loss is increased and the unloaded Q of the resonators is reduced to about 3,500. In order to improve the phase noise of an oscillator, a variety of the dielectric resonators are developed to find out the best unloaded Q and correct frequency. EM Simulations and measurements show close agreements.
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