MBE生长掺硅场效应管的制备、性能和表征

Q. Chen, M. Willander
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引用次数: 0

摘要

在Si MBE生长过程中,采用低能Sb离子掺杂技术制备了Si δ掺杂场效应管,实现了δ掺杂和低温器件加工预算。栅极长度为2 /spl mu/m的fet的栅极击穿电压为3.8 ~ 4.7 V,最大外部跨导为28 mS/mm,对应的本征跨导为42 mS/mm。这些结果是迄今为止在类似栅极长度的Si /spl δ /- fet中报道的最好的。采用C-V和I-V技术测量了Si /spl δ /- fet的栅极电荷控制和低场漂移迁移率。实测电荷控制具有较强的非线性,与理论计算结果吻合较好。我们首次观察到,随着栅极电压的增加,掺δ FET的漂移迁移率降低
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication, performance and characterization of Si delta-doped FET grown by MBE
Si delta-doped FETs have been fabricated using low-energy Sb ion doping technique during Si MBE growth to realize delta-doping and a low temperature device processing budget. The FETs with a gate length of 2 /spl mu/m showed a gate breakdown voltage of 3.8-4.7 V and a maximum extrinsic transconductance of 28 mS/mm, corresponding to an intrinsic transconductance of 42 mS/mm. Those results are the best reported so far in Si /spl delta/-FETs of similar gate length. The gate charge-control and low-field drift-mobility in Si /spl delta/-FETs were measured using C-V and I-V techniques. Measured charge-control had a strong nonlinearity and was in good agreement with theoretical calculation. We observed, for the first time, that the drift-mobility in the delta-doped FET was decreased with the increasing gate voltage.<>
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