AlGaN/GaN HEMT的时域漏阻测量和基于tcad的器件仿真:物理机理研究

N. Subramani, M. Bouslama, R. Sommet, J. Nallatamby
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引用次数: 5

摘要

本文通过时域漏阻测量和基于tcad的物理器件模拟,研究了在SiC衬底上生长的GaN/AlGaN/GaN HEMT的陷阱诱导漏阻色散机制。研究了漏极导通电压脉冲对漏极电流的瞬态变化。此外,通过在器件的不同区域引入陷阱进行了TCAD物理模拟,以确定导致漏阻机制的陷阱的物理位置。仿真结果验证了GaN缓冲中存在的类受体陷阱是测量中观察到的漏阻效应的原因。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Time Domain Drain Lag Measurement and TCAD-based Device Simulations of AlGaN/GaN HEMT: Investigation of Physical Mechanism
In this work, traps induced drain-lag dispersion mechanism of GaN/AlGaN/GaN HEMT grown on SiC substrate is investigated through time domain drain lag measurement and TCAD-based physical device simulations. The transient variation of the drain current owing to applied drain turn-on voltage pulses have been examined. Furthermore, TCAD physical simulations have been performed by introducing traps in various regions of the device, in order to identify the physical location of traps causing drain-lag mechanism. The simulation results validate that acceptor-like traps existing in the GaN buffer are responsible for the drain-lag effect observed in measurement.
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