Y.S. Kim, Y. Shimamune, M. Fukuda, A. Katakami, A. Hatada, K. Kawamura, H. Ohta, T. Sakuma, Y. Hayami, H. Morioka, J. Ogura, T. Minami, N. Tamura, T. Mori, M. Kojima, K. Sukegawa, K. Hashimoto, M. Miyajima, S. Satoh, T. Sugii
{"title":"缺陷形成的抑制及其对SiGe源/漏极pMOSFET短沟道效应和驱动性的影响","authors":"Y.S. Kim, Y. Shimamune, M. Fukuda, A. Katakami, A. Hatada, K. Kawamura, H. Ohta, T. Sakuma, Y. Hayami, H. Morioka, J. Ogura, T. Minami, N. Tamura, T. Mori, M. Kojima, K. Sukegawa, K. Hashimoto, M. Miyajima, S. Satoh, T. Sugii","doi":"10.1109/IEDM.2006.346920","DOIUrl":null,"url":null,"abstract":"The impact of defects on the short channel effects (SCE) and the drivability of a pMOSFET with a SiGe source/drain is described, and useful methods to reduce defect formation are suggested. The influence of defects on device performance is found to become more severe as recess depth increases and/or channel length decreases. By optimizing the epitaxial process, including an in-situ precleaning step, the initial defect density is reduced, and by introducing a cap layer on a SiGe layer, the thermal stability of the SiGe layer is improved. The optimized devices enhance mobility 42% by maximizing the strain effect and provide better SCE characteristics by suppressing boron diffusion","PeriodicalId":366359,"journal":{"name":"2006 International Electron Devices Meeting","volume":"70 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Suppression of Defect Formation and Their Impact on Short Channel Effects and Drivability of pMOSFET with SiGe Source/Drain\",\"authors\":\"Y.S. Kim, Y. Shimamune, M. Fukuda, A. Katakami, A. Hatada, K. Kawamura, H. Ohta, T. Sakuma, Y. Hayami, H. Morioka, J. Ogura, T. Minami, N. Tamura, T. Mori, M. Kojima, K. Sukegawa, K. Hashimoto, M. Miyajima, S. Satoh, T. Sugii\",\"doi\":\"10.1109/IEDM.2006.346920\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The impact of defects on the short channel effects (SCE) and the drivability of a pMOSFET with a SiGe source/drain is described, and useful methods to reduce defect formation are suggested. The influence of defects on device performance is found to become more severe as recess depth increases and/or channel length decreases. By optimizing the epitaxial process, including an in-situ precleaning step, the initial defect density is reduced, and by introducing a cap layer on a SiGe layer, the thermal stability of the SiGe layer is improved. The optimized devices enhance mobility 42% by maximizing the strain effect and provide better SCE characteristics by suppressing boron diffusion\",\"PeriodicalId\":366359,\"journal\":{\"name\":\"2006 International Electron Devices Meeting\",\"volume\":\"70 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 International Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2006.346920\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2006.346920","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Suppression of Defect Formation and Their Impact on Short Channel Effects and Drivability of pMOSFET with SiGe Source/Drain
The impact of defects on the short channel effects (SCE) and the drivability of a pMOSFET with a SiGe source/drain is described, and useful methods to reduce defect formation are suggested. The influence of defects on device performance is found to become more severe as recess depth increases and/or channel length decreases. By optimizing the epitaxial process, including an in-situ precleaning step, the initial defect density is reduced, and by introducing a cap layer on a SiGe layer, the thermal stability of the SiGe layer is improved. The optimized devices enhance mobility 42% by maximizing the strain effect and provide better SCE characteristics by suppressing boron diffusion
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