高耐热基板(BN300)在球栅阵列封装中的应用

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI:10.1109/IEMT.1996.559684

A. Hagimura, K. Shima, K. Asahina, H. Sakuraba, K. Fujita, J. Tanaka

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引用次数: 0

摘要

MTC利用MTC的聚合物合金技术开发的高耐热基板材料BN300在高温下表现出良好的性能，可以应用于先进的封装。本文介绍了BN300的高温性能和可靠性。同时，提出了一种利用BN300的新型包装工艺。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Application for ball grid array package by using high heat resistant substrate (BN300)

High heat resistance substrate material, BN300, which MTC has developed utilizing MTC's polymer alloy technology, shows good performance at high temperature and is able to be applied to the advanced package. In this paper, the high temperature performances and reliability of BN300 are presented. Also, a new packaging process using BN300 is proposed.

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来源期刊

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium

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