智能可穿戴设备超低功耗28nm CMOS双芯片ASIC平台

Y. Pu, D. Butterfield, Jorge A. García, Jing Xie, Mark Lin, Rohit Sauhta, Rick Farley, Steven Shellhammer, Moses Derkalousdian, Adam Newham, Chunlei Shi, R. Shenoy, Evgeni Gousev, Rashid Attar
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引用次数: 5

摘要

本文提出了一种超低功耗的(医疗)智能耳机双芯片平台。它搭配两个定制asic: i) Blackghost -一个28nm CMOS近阈值vdd供电和高度集成的SoC,具有嵌入式PMU, MCU, 16期DSP引擎和强化音频子系统岛;ii) DIRAC -一个28nm CMOS永远在线的语音带射频和混合信号音频编解码器前端。DIRAC编解码器的动态范围为~90dB,总功耗<200µW。对于黑鬼的快速唤醒,睡眠和待机,DIRAC还具有低延迟麦克风活动检测(MAD)和TX-RX交叉衰落方案。这种双芯片平台使小型化的可听设备能够以极低的能量预算运行新兴的音频算法,如深度学习。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Ultra-low-power 28nm CMOS Dual-die ASIC Platform for Smart Hearables
This paper presents an ultra-low-power dual-die platform for (medical) smart hearables. It pairs two custom ASICs: i) Blackghost - a 28nm CMOS near-threshold-VDDpowered and highly integrated SoC with embedded PMU, MCU, 16-issue DSP engine and hardened audio sub-system island; ii) DIRAC - a 28nm CMOS always-on voiceband RF & mixed-signal audio codec frontend. With ~90dB of dynamic range, DIRAC codec consumes <200µW of total power. For fast wakeup, sleep and standby of Blackghost, DIRAC also features low latency microphone activity detection (MAD) and TX-RX cross fading scheme. This dual-die platform enables miniaturized hearable devices capable of running emerging audio algorithms like deep learning at an extremely low enerzy budget.
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