热和拥塞驱动的3D集成电路全局路由器

Debashri Roy, P. Ghosal, Nabanita Das
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引用次数: 7

摘要

近年来,超大规模集成电路(VLSI)的大问题空间使得全局路由问题成为NP完全问题。随着三维集成电路(3D IC)的出现,这个问题变得更加复杂。本文利用模糊逻辑提出了一种多目标全局路由技术,克服了确定性方法的局限性。在全局路由过程中,模糊逻辑专家系统根据生成的预路由引导信息进行决策。提出的方法主要针对现代3D集成电路。这项主要工作主要包含在3D集成电路的标准单元设计中。基于所提出的算法设计了一个双引脚全局路由工具,在ISPD'98基准测试中获得了85-97%的可达性,可忽略时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A thermal and congestion driven global router for 3D integrated circuits
During recent days, the large problem space of very large scale integrated (VLSI) circuits has led global routing problem to a NP Complete one. With the advent of three dimensional integrated circuits (3D IC) the problem has become more complex. In this paper, a multi-objective global routing technique is formulated using fuzzy logic to get rid of the limitations of deterministic approaches. During global routing the decision is taken from a fuzzy logic expert system depending upon some generated pre-routing guiding information. Proposed approach is mainly focused on the modern generation 3D ICs. This primary work is mainly incorporated in the standard cell design for 3D ICs. A two-pin global router tool is designed based on the proposed algorithm resulting 85-97% routability in negligible time for ISPD'98 benchmarks.
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