片上通信设计:障碍和途径

L. Carloni, A. Sangiovanni-Vincentelli
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引用次数: 17

摘要

半导体行业正在经历从“计算约束设计”到“通信约束设计”的范式转变:在一个时钟周期内可以达到的晶体管数量,而不是那些可以集成在芯片上的晶体管数量,将驱动设计过程。互连延迟将对片上通信架构的设计产生重大影响,这些架构越来越依赖于有线管道,以超越传统的有线缓冲能力。在长线路上插入有状态中继器,而不是简单的无状态中继器,为同步设计方法带来了主要的序列。这是当今大多数商用芯片设计流程的基础,但如果保持不变,将导致未来设计流程的时序关闭问题加剧。将芯片视为分布式系统的新方法是必要的。延迟不敏感设计是朝着这个方向迈出的一步。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On-chip communication design: roadblocks and avenues
The semiconductor industry is experiencing a paradigm shift from "computation-bound design" to "communication-bound design": the number of transistors that can be reached in a clock cycle, and not those that can be integrated on a chip, will drive the design process. Interconnect latency will have a major impact on the design of on-chip communication architectures, which increasingly rely on wire pipelining to go beyond the capabilities of traditional wire buffering. The insertion of stateful repeaters on long wires, instead of simply stateless repeaters, carries major sequences for the synchronous design methodology. This is the foundation of the design flows for the majority of commercial chips today, but, if left unchanged, will lead to an exacerbation of the timing closure problem for tomorrow's design flows. New methodologies that regard the chip as a distributed system are necessary. Latency-insensitive design is a step in this direction.
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