垂直微孔连接采用独特的导电复合材料

G. Matijasevic, P. Gandhi, C. Gallagher
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引用次数: 2

摘要

提出了一种适用于电子模块中所有主要封装和再分配元件的新型基础技术。基于瞬态液相烧结(TLPS)的独特聚合物/金属复合导体系列可用于芯片封装和PWB衬底应用,层间连接和SMT组装。采用光成像介质导体浆料填充和热加工的方法制备了无地盲埋过孔高密度多层电路。类似地直接在固有平面化电路层上制备过孔层。细至50 /spl mu/m的线路/空间和小至75 /spl mu/m的通孔已经生产出来。以这种方式依次建立层,允许在各种材料上进行增材制造,包括金属基板。这些有机金属Ormet/sup (R)/复合材料也用于双面电路之间的层间连接,以形成电路垫之间的垂直互连。这种平行建造方法使用标准的层压工艺来实现垂直连接。连接垫板的孔小于100 /spl mu/m。细线双面电路也可以作为贴片连接到低密度板上,以提供局部高密度区域。复合导体的变化也可以代替焊料用于表面安装和COB组装。这些可靠的、高导热/高导电性的材料与传统技术的标准金属饰面兼容,可以根据需要零碎地使用,但是当所有元素一起使用时,才能实现最大的可靠性和成本效益。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Vertical microvia connections achieved using a unique conductive composite material
A novel base technology applicable to all major packaging and redistribution elements in an electronic module is presented. A unique polymer/metal composite conductor family based on transient liquid phase sintering (TLPS) can be used for chip package and PWB substrate applications, in interlayer connections, and for SMT assembly. High density multilayer circuits with landless blind and buried vias are fabricated by conductor paste filling of photoimaged dielectrics and thermal processing. Via layers are similarly prepared directly on the inherently planarized circuit layer. Circuit traces as fine as 50 /spl mu/m lines/spaces and vias as small as 75 /spl mu/m have been produced. Building up layers sequentially in this way allows additive fabrication on various materials, including metal substrates. These organic-metallic Ormet/sup (R)/ composites have also been used in interlayer connections between two-sided circuits to form vertical interconnects between circuit pads. This parallel build-up approach uses a standard lamination process to achieve vertical connections. Vias less than 100 /spl mu/m have been used to connect the pads. Fine line two-sided circuits can also be attached as a patch to low density boards to provide localized high density areas. Variations of the composite conductor can also replace solder for surface mount and COB assembly. These reliable, high thermal/electrical conductivity materials are compatible with standard metal finishes of conventional technologies and can be used piecemeal as desired, but the largest reliability and cost benefit is realized when all of the elements are used together.
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