{"title":"使用电路板边缘终端与电源/返回平面弹跳相关的组件性能","authors":"M. Montrose","doi":"10.1109/EMCSA.2010.6141517","DOIUrl":null,"url":null,"abstract":"This paper illustrates effects on digital components due to reflected EM waves created by different board edge termination methodologies. Depending on the physical location of a digital device, relative to the edge of the printed circuit board (PCB), either a voltage or return plane bounce may occur that exceeds operational margin levels of these devices","PeriodicalId":242783,"journal":{"name":"2010 Electromagnetic Compatibility Symposium - Melbourne","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Component performance associated with power/return plane bounce using board edge termination\",\"authors\":\"M. Montrose\",\"doi\":\"10.1109/EMCSA.2010.6141517\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper illustrates effects on digital components due to reflected EM waves created by different board edge termination methodologies. Depending on the physical location of a digital device, relative to the edge of the printed circuit board (PCB), either a voltage or return plane bounce may occur that exceeds operational margin levels of these devices\",\"PeriodicalId\":242783,\"journal\":{\"name\":\"2010 Electromagnetic Compatibility Symposium - Melbourne\",\"volume\":\"49 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 Electromagnetic Compatibility Symposium - Melbourne\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCSA.2010.6141517\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 Electromagnetic Compatibility Symposium - Melbourne","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCSA.2010.6141517","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Component performance associated with power/return plane bounce using board edge termination
This paper illustrates effects on digital components due to reflected EM waves created by different board edge termination methodologies. Depending on the physical location of a digital device, relative to the edge of the printed circuit board (PCB), either a voltage or return plane bounce may occur that exceeds operational margin levels of these devices