用于功率IC器件的热增强SOIC封装

8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings Pub Date : 1996-05-20 DOI:10.1109/ISPSD.1996.509505

A. Chowdhury, B. Guenin, R. Groover, S. Anderson, E.J. Derian

{"title":"用于功率IC器件的热增强SOIC封装","authors":"A. Chowdhury, B. Guenin, R. Groover, S. Anderson, E.J. Derian","doi":"10.1109/ISPSD.1996.509505","DOIUrl":null,"url":null,"abstract":"Different design techniques to improve the thermal performance of a standard SOIC package have been evaluated and their thermal performance compared through thermal models by utilizing finite element analysis. It is shown that by enhancing the design of a standard SOIC package the thermal performance can be improved by as much as 46% over that of the standard design.","PeriodicalId":377997,"journal":{"name":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","volume":"89 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Thermally-enhanced SOIC packages for power IC devices\",\"authors\":\"A. Chowdhury, B. Guenin, R. Groover, S. Anderson, E.J. Derian\",\"doi\":\"10.1109/ISPSD.1996.509505\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Different design techniques to improve the thermal performance of a standard SOIC package have been evaluated and their thermal performance compared through thermal models by utilizing finite element analysis. It is shown that by enhancing the design of a standard SOIC package the thermal performance can be improved by as much as 46% over that of the standard design.\",\"PeriodicalId\":377997,\"journal\":{\"name\":\"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings\",\"volume\":\"89 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.1996.509505\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1996.509505","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

为了提高标准SOIC封装的热性能，我们对不同的设计技术进行了评估，并通过利用有限元分析的热模型对其热性能进行了比较。结果表明，通过改进标准SOIC封装的设计，其热性能可以比标准设计提高46%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Thermally-enhanced SOIC packages for power IC devices

Different design techniques to improve the thermal performance of a standard SOIC package have been evaluated and their thermal performance compared through thermal models by utilizing finite element analysis. It is shown that by enhancing the design of a standard SOIC package the thermal performance can be improved by as much as 46% over that of the standard design.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings

自引率

0.00%

发文量