基于tpdice的管道内存结构中的多节点干扰缓解

D. R. Blum, J. Delgado-Frías
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引用次数: 0

摘要

当暴露于粒子撞击导致多个节点中断时,传统的单中断耐受辐射硬化SRAM设计很容易失效。当具有小特征尺寸的设备在高放射性环境中运行时,这种事件就很可能发生。本文分析了为减轻90纳米CMOS中多节点中断而创建的硬化设计技术的有效性。从结果中可以得出结论,通过硬化存储器和布局设计技术的独特组合,以及适度和可计算的布局交错水平,可以实现对90 nm多节点中断的可接受容忍度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Multiple node upset mitigation in TPDICE-based pipeline memory structures
Traditional single disruption tolerant radiation hardened SRAM designs are vulnerable to failure when exposed to particle strikes that induce multiple node disruptions. Such events become likely when devices with small feature sizes are operated in highly radioactive environments. This paper analyzes the effectiveness of hardened by design techniques created with the intent to mitigate multiple node disruptions in 90 nm CMOS. From the results, it has been concluded that acceptable tolerance to multiple node disruptions in 90 nm can be achieved through a unique combination of hardened memory and layout design techniques with moderate and calculable levels of layout interleaving.
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