D. Yamane, T. Matsushima, T. Konishi, H. Toshiyoshi, K. Machida, K. Masu
{"title":"采用多层高密度金属的双轴MEMS惯性传感器用于阵列CMOS-MEMS加速度计","authors":"D. Yamane, T. Matsushima, T. Konishi, H. Toshiyoshi, K. Machida, K. Masu","doi":"10.1109/DTIP.2014.7056643","DOIUrl":null,"url":null,"abstract":"This paper reports a novel dual-axis MEMS inertial sensor that utilizes multi-layered electroplated gold. All the MEMS structures are made by gold electroplating that is used as post-CMOS process. Due to the high density of gold, the Brownian noise on the proof mass becomes lower than those made of other materials in the same size. The miniaturized MEMS accelerometer can be integrated in an arrayed CMOS-MEMS accelerometer to detect a broad range of acceleration on a single sensor chip.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A dual-axis MEMS inertial sensor using multi-layered high-density metal for an arrayed CMOS-MEMS accelerometer\",\"authors\":\"D. Yamane, T. Matsushima, T. Konishi, H. Toshiyoshi, K. Machida, K. Masu\",\"doi\":\"10.1109/DTIP.2014.7056643\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports a novel dual-axis MEMS inertial sensor that utilizes multi-layered electroplated gold. All the MEMS structures are made by gold electroplating that is used as post-CMOS process. Due to the high density of gold, the Brownian noise on the proof mass becomes lower than those made of other materials in the same size. The miniaturized MEMS accelerometer can be integrated in an arrayed CMOS-MEMS accelerometer to detect a broad range of acceleration on a single sensor chip.\",\"PeriodicalId\":268119,\"journal\":{\"name\":\"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)\",\"volume\":\"40 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DTIP.2014.7056643\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DTIP.2014.7056643","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A dual-axis MEMS inertial sensor using multi-layered high-density metal for an arrayed CMOS-MEMS accelerometer
This paper reports a novel dual-axis MEMS inertial sensor that utilizes multi-layered electroplated gold. All the MEMS structures are made by gold electroplating that is used as post-CMOS process. Due to the high density of gold, the Brownian noise on the proof mass becomes lower than those made of other materials in the same size. The miniaturized MEMS accelerometer can be integrated in an arrayed CMOS-MEMS accelerometer to detect a broad range of acceleration on a single sensor chip.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
