在高辐射环境中使用的高电阻率衬底上的全耗尽CMOS有源像素传感器的特性

T. Hirono, M. Barbero, P. Breugnon, S. Godiot, T. Hemperek, F. Hügging, J. Janssen, H. Krüger, Jian Liu, P. Pangaud, I. Perić, D. Pohl, A. Rozanov, P. Rymaszewski, N. Wermes
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引用次数: 12

摘要

耗尽型CMOS有源传感器(DMAPS)用于高辐射环境下的高能粒子物理实验,如ATLAS高亮度大型强子对撞机(HL-LHC)。由于在恶劣的辐射环境中必须采用漂移收集电荷,因此需要对高阻传感器材料施加高偏置电压。在这项工作中,采用150nm CMOS工艺在电阻率为>.2 kΩ·cm的衬底上制作了DMAPS原型,该衬底薄至100 μm。完全耗尽发生在20V左右,远低于110v的击穿电压。一个读出芯片已被附加为快速触发读出。所述原型还使用了亚像素解码的概念,该原型芯片的三个像素被读出芯片的一个像素读出。由于辐射耐受性是DMAPS中最受关注的问题之一,CCPD_LF芯片已分别用x射线和中子照射,总电离剂量为50 Mrad,影响量为1015neq/cm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterization of fully depleted CMOS active pixel sensors on high resistivity substrates for use in a high radiation environment
Depleted CMOS active sensors (DMAPS) are being developed for high-energy particle physics experiments in high radiation environments, such as in the ATLAS High Luminosity Large Hadron Collider (HL-LHC). Since charge collection by drift is mandatory for harsh radiation environment, the application of high bias voltage to high resistive sensor material is needed. In this work, a prototype of a DMAPS was fabricated in a 150nm CMOS process on a substrate with a resistivity of >2 kΩ·cm that was thinned to 100 μm. Full depletion occurs around 20V, which is far below the breakdown voltage of 110 V. A readout chip has been attached for fast triggered readout. Presented prototype also uses a concept of sub-pixel en/decoding three pixels of the prototype chip are readout by one pixel of the readout chip. Since radiation tolerance is one of the largest concerns in DMAPS, the CCPD_LF chip has been irradiated with X-rays and neutrons up to a total ionization dose of 50 Mrad and a fluence of 1015neq/cm2, respectively.
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