用纳米压痕技术分析聚酰亚胺软基板上铂键焊垫与金线的键合

Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004. Pub Date : 2004-12-06 DOI:10.1109/ICM.2004.1434704

M. Aslam

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引用次数: 1

摘要

热超声金线键合是微电子工业中常用的可靠键合技术。金属化在聚酰亚胺(PI)等软材料上的粘合性是一个值得关注的问题，特别是当粘合垫由铂材料的薄涂层制成时。纳米压痕技术常用来测量薄膜涂层的表面性能，如亚微米尺度的杨氏模量和硬度。通过在聚酰亚胺衬底上溅射不同厚度的铂，制备了4种不同的压头样品，研究了压头厚度随外加载荷的变化规律。收集了四种样品的“载荷-位移”和“硬度-位移”纳米压痕数据，研究了薄膜铂材料的变形行为和力学性能。本文对铂衬垫进行了分析，发现在聚酰亚胺上镀有300 nm铂层的样品比镀有100 nm铂层的样品粘合效果好。

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Analysis of platinum bond pads on polyimide soft substrate for wire bonding with Au wire using nano-indentation technique

The thermosonic gold wire bonding is a common technology in microelectronics industry for reliable bonding. The bondability of metallisation on soft material like polyimide (PI) is a matter of concern, especially when the bond pads are made of thin coating of platinum material. Nano-indentation technique is commonly used to measure surface properties of thin film coatings, such as Young's modulus and hardness within sub-micron scale. Four different samples were produced by sputtering different thickness of Pt on polyimide substrate to study the behaviour of thickness versus applied load of indentor. The nano-indentation data regarding "load versus displacement" and "hardness versus displacement" for all the four samples were collected and deformation behaviour and mechanical properties of thin film platinum material had been investigated. In this paper, the analysis of platinum pads has been carried out and it was observed that the samples with 300 nm platinum layer on polyimide were bonded well as compared to 100 nm thickness of platinum material.

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Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.

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