由双极结晶体管芯片引起的不必要的微波振荡器频移

T. Folk, L. Mallette, J. Ulmer
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引用次数: 0

摘要

1994年7月,经过x射线检查后,在测试期间发现两个空间合格频率合成器出现噪音爆裂现象。一个跨公司、跨职能的调查小组成立,以确定对飞机硬件潜在影响的根本原因。问题的根源被隔离为双极结晶体管(BJT)的不良键合。噪声爆裂现象的根本原因尚未确定,但与VCO振荡器中BJT的模具附着过程有很强的相关性,与BJT环境有软相关性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Unwanted microwave oscillator frequency shifts induced by bipolar junction transistor die attach
Two space qualified frequency synthesizers were found to exhibit noise bursting during testing, following X-ray examination, in July 1994. An inter-company, cross-functional investigation team was formed to determine root cause because of the potential impact on flight hardware. The source of the problem was isolated to poor bonding of a bipolar junction transistor (BJT). The root cause of the noise bursting phenomena was not positively identified, but there is strong correlation to the die attachment process of the BJT in the oscillator of the VCO and a soft correlation with the BJT environment.
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