通用测试平台系列,用于模块,电路板和子组件级测试

M. Breen
{"title":"通用测试平台系列,用于模块,电路板和子组件级测试","authors":"M. Breen","doi":"10.1109/AUTEST.2000.885573","DOIUrl":null,"url":null,"abstract":"As defense industry procurement budgets continue to decrease and contractor consolidation increases, the demand for cost effective and timely product testing and efficient test facility utilization increases. To reduce the product test cost and cycle-time and test-facility space requirements, the Raytheon Missile Systems Test-Systems-Design-Center (TSDC) developed and implemented the Standard Test Equipment Platform (STEP) family. The STEP family consists of the Analog STEP (ANSTEP), Analog/Digital STEP (ADSTEP), Radio Frequency (RF) STEP (RFSTEP), and Infra-red (IR) STEP (IRSTEP). The family is capable of testing electronic modules, boards, and sub-assemblies in the analog and low-level digital; digital simulation generation; intermediate frequency, RF, and microwave; and IR regimes. This paper presents: 1. The STEP approach to reducing product-test cost, cycle-time, and facility requirements, 2. The history and development of the STEP family, 3. A technical overview of each member of the STEP family, and 4. The implementation of the STEP family as if relates to reducing product-test, cost cycle-time, and facility requirements while meeting difficult test requirements; influencing standardized test requirements; providing extensive test-level capability; providing a wide stimulus, switching, and measurement capability; establishing an easily integrated common technical data package; and ensuring a clear expansion/evolution path.","PeriodicalId":334061,"journal":{"name":"2000 IEEE Autotestcon Proceedings. IEEE Systems Readiness Technology Conference. Future Sustainment for Military Aerospace (Cat. No.00CH37057)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Common test-platform family for module, board, and sub-assembly level test\",\"authors\":\"M. Breen\",\"doi\":\"10.1109/AUTEST.2000.885573\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As defense industry procurement budgets continue to decrease and contractor consolidation increases, the demand for cost effective and timely product testing and efficient test facility utilization increases. To reduce the product test cost and cycle-time and test-facility space requirements, the Raytheon Missile Systems Test-Systems-Design-Center (TSDC) developed and implemented the Standard Test Equipment Platform (STEP) family. The STEP family consists of the Analog STEP (ANSTEP), Analog/Digital STEP (ADSTEP), Radio Frequency (RF) STEP (RFSTEP), and Infra-red (IR) STEP (IRSTEP). The family is capable of testing electronic modules, boards, and sub-assemblies in the analog and low-level digital; digital simulation generation; intermediate frequency, RF, and microwave; and IR regimes. This paper presents: 1. The STEP approach to reducing product-test cost, cycle-time, and facility requirements, 2. The history and development of the STEP family, 3. A technical overview of each member of the STEP family, and 4. The implementation of the STEP family as if relates to reducing product-test, cost cycle-time, and facility requirements while meeting difficult test requirements; influencing standardized test requirements; providing extensive test-level capability; providing a wide stimulus, switching, and measurement capability; establishing an easily integrated common technical data package; and ensuring a clear expansion/evolution path.\",\"PeriodicalId\":334061,\"journal\":{\"name\":\"2000 IEEE Autotestcon Proceedings. IEEE Systems Readiness Technology Conference. Future Sustainment for Military Aerospace (Cat. No.00CH37057)\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 IEEE Autotestcon Proceedings. IEEE Systems Readiness Technology Conference. Future Sustainment for Military Aerospace (Cat. No.00CH37057)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/AUTEST.2000.885573\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 IEEE Autotestcon Proceedings. IEEE Systems Readiness Technology Conference. Future Sustainment for Military Aerospace (Cat. No.00CH37057)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AUTEST.2000.885573","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

随着国防工业采购预算的持续减少和承包商整合的增加,对成本有效和及时的产品测试和有效的测试设备利用率的需求增加。为了降低产品测试成本、周期时间和测试设施空间要求,雷神导弹系统测试系统设计中心(TSDC)开发并实施了标准测试设备平台(STEP)系列。STEP系列包括模拟STEP (ANSTEP),模拟/数字STEP (ADSTEP),射频STEP (RFSTEP)和红外STEP (IRSTEP)。该系列能够测试模拟和低水平数字的电子模块、电路板和子组件;数字仿真生成;中频、射频、微波;和IR制度。本文主要介绍:1。STEP方法减少产品测试成本、周期时间和设备要求;STEP家族的历史与发展;STEP家族的每个成员的技术概述;STEP系列的实施似乎与减少产品测试,成本周期时间和设施要求有关,同时满足困难的测试要求;影响标准化考试要求;提供广泛的测试级能力;提供广泛的刺激、切换和测量能力;建立易于整合的通用技术数据包;确保清晰的扩展/进化路径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Common test-platform family for module, board, and sub-assembly level test
As defense industry procurement budgets continue to decrease and contractor consolidation increases, the demand for cost effective and timely product testing and efficient test facility utilization increases. To reduce the product test cost and cycle-time and test-facility space requirements, the Raytheon Missile Systems Test-Systems-Design-Center (TSDC) developed and implemented the Standard Test Equipment Platform (STEP) family. The STEP family consists of the Analog STEP (ANSTEP), Analog/Digital STEP (ADSTEP), Radio Frequency (RF) STEP (RFSTEP), and Infra-red (IR) STEP (IRSTEP). The family is capable of testing electronic modules, boards, and sub-assemblies in the analog and low-level digital; digital simulation generation; intermediate frequency, RF, and microwave; and IR regimes. This paper presents: 1. The STEP approach to reducing product-test cost, cycle-time, and facility requirements, 2. The history and development of the STEP family, 3. A technical overview of each member of the STEP family, and 4. The implementation of the STEP family as if relates to reducing product-test, cost cycle-time, and facility requirements while meeting difficult test requirements; influencing standardized test requirements; providing extensive test-level capability; providing a wide stimulus, switching, and measurement capability; establishing an easily integrated common technical data package; and ensuring a clear expansion/evolution path.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信