最新功率放大器集成电路综述

2017 10th Global Symposium on Millimeter-Waves Pub Date : 2017-05-01 DOI:10.1109/GSMM.2017.7970329

iSwee Liu, Kaixue Ma, Shouxian Mou, F. Meng

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引用次数: 5

摘要

本文简要介绍了RFIC功率放大器(PA)设计的最新研究进展，并介绍了我们在CMOS、SiGe和III-V半导体三种技术领域的PA设计和一些典型的专业领域的最新设计。最后，对片上PA的三个研究热点和研究趋势进行了总结和讨论。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A review of recent power amplifier IC

This paper given a brief and concise discussion on latest research of RFIC power amplifier (PA) designs, showing the frontier state-of-the-art developments, and then present our PA designs and some typical newest designs in expertise area with three technologies, a.k.a CMOS, SiGe, and III-V semiconductor. At last, three research hotspots and research trends about on chip PA are summarized and discussed.

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2017 10th Global Symposium on Millimeter-Waves

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