以下是来自AIM的低暗电流LWIR和VLWIR MCT二维焦平面探测器阵列

M. Haiml, D. Eich, W. Fick, H. Figgemeier
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引用次数: 2

摘要

近年来,高工作温度(HOT)探测器在中波红外光谱范围(MWIR)的应用受到了广泛关注[1,2]。在LWIR和VLWIR光谱范围内,在提高工作温度的同时保持在较低温度下获得的探测器性能被证明是非常困难的。对探测器的材料质量和探测器的加工要求也越来越高。随着LWIR热探测器应用的不断发展,AIM作为LWIR MCT探测器的领导者已经解决了这一挑战。我们想指出的是,AIM在降低暗电流方面有着长期的记录,特别是通过在LWIR和VLWIR光谱范围内掺杂外源Au[3,4,5,6]。在过去的几年中,我们成熟了p-on-n LWIR技术,这是高性能小像素间距平面LWIR HOT MCT器件的关键技术[9]。本文介绍了我国低暗电流平面MCT光电二极管技术的现状。该开发由ESA TRP合同资助,并导致后续合同进一步优化LWIR和VLWIR MCT和相应的roic,特别是用于低温,大面积,天文学应用。AIM制造HOT MCT器件的方法是采用垂直浸渍法,在富te熔体的晶格匹配内部生长的CdZnTe (CZT)衬底上进行液相外延(LPE)生长[7,8]。该方法允许在LWIR-VLWIR截止波长范围内,在直径为1.5英寸的区域内,生长出目前在层厚(±1μm)和成分(±0.3μm截止波长)上均匀的大型MCT晶圆。我们研究并比较了不同掺杂水平和其他工艺参数下n-on-p和p-on-n生长的技术限制和性能。在下面,我们展示了这两种技术在512 x 320像素阵列上的结果,像素间距为20μm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Below Rule’07 low dark current LWIR and VLWIR MCT 2D focal plane detector arrays from AIM
In recent years, high-operation temperature (HOT) detector applications in the mid-wave infrared spectral range (MWIR) have widely attracted attention [1, 2]. In the LWIR and VLWIR spectral ranges, an increase in operating temperature while keeping the detector performance obtained at lower temperatures proved to be significantly more difficult. The demands on detector material quality and detector processing are much higher. With LWIR HOT detector applications more and more evolving, AIM as a leader in LWIR MCT detectors has addressed the challenge. We like to note that AIM has a long standing track record on dark-current reduction, especially by extrinsic Au doping in the LWIR and VLWIR spectral range [3, 4, 5, 6]. During the last couple of years we matured our p-on-n LWIR technology, a key technology for high-performance small pixel pitch planar LWIR HOT MCT devices [9]. In this paper we present the status of our n-on-p and p-on-n low dark current planar MCT photodiode technology. The development was funded by ESA TRP contracts and resulted in follow-on contracts to even further optimize LWIR and VLWIR MCT and corresponding ROICs, especially for low-temperature, large area, astronomy applications. AIM’s manufacturing of HOT MCT devices is based on the liquid phase epitaxial (LPE) growth on latticematched in-house grown CdZnTe (CZT) substrates from a Te-rich melt, using the vertical dipping method [7, 8]. This method allows growing large MCT wafers with currently fair homogeneity in layer thickness (±1μm) as well as in composition (±0.3μm cut-off wavelength) across an area of 1.5 inch diameter in the LWIR-VLWIR cut-off wavelength range. We have investigated and compared technological constraints and performance of n-on-p and p-on-n growth for different doping levels and other process parameters. In the following we present the results for both technologies on 512 x 320 pixel format arrays with 20μm pixel pitch.
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