电源模块封装结构研究

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI:10.1109/IWIPP.2000.885180

T. Ohbu, K. Kodani, N. Tada, T. Matsumoto, K. Kijima, S. Saito

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引用次数: 5

摘要

为了实现大电流电源模块，我们研究了芯片温升最低的最佳芯片布局，以及接触热阻的减小方法。结果表明，芯片温升降低24%是可能的。为了抑制浪涌电压，我们研究了最佳母线结构。母线的杂散电感可以降低约40%。

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Study of power module package structures

In order to realize a high current power module, we studied optimum chip layout with lowest chip temperature rise, and the reduction method of contact thermal resistance. We showed that about 24% reduction of chip temperature rise was possible. In order to inhibit surge voltages, we studied the optimum bus-bar structure. The stray inductance of the bus-bar showed that about 40% reduction was possible.

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IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)

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